The Qualcomm Snapdragon 670 processor scores 2887 points in the Passmark benchmark, featuring Two 2GHz Cortex A75 Kryo 360 Six 1.7GHz Cortex A55 Kryo 360 cores. This performance is comparable to the Huawei HiSilicon Kirin 970 and Mediatek Helio P90.
Benchmark Scores Comparison: Passmark Results for Similar Chips
View Full List of Passmark Scores and Rankings
Benchmark |
Qualcomm Snapdragon 670 Score |
AnTuTu |
176653 |
Geekbench (Multi Core) |
1429 |
Geekbench (Single Core) |
350 |
3DMark |
665 |
Passmark |
2887 |
Qualcomm Snapdragon 670 Specification
Qualcomm Snapdragon 670 Specification |
Details |
Designed by |
Qualcomm |
Model |
Snapdragon 670 |
Manufacturer |
Samsung |
Launch date |
August 2018 |
Architecture |
ARMv8-A |
Bit width |
64-bit support |
Architecture |
Octa-core: 2x 2GHz Cortex A75 Kryo 360 + 6x 1.7GHz Cortex A55 Kryo 360 |
Number of Cores / Threads |
8 |
Clock Speed |
up to 2 GHz |
Big |
Two 2GHz Cortex A75 Kryo 360 |
Mid |
Six 1.7GHz Cortex A55 Kryo 360 |
Integrated GPU |
Adreno 615 |
GPU Cores |
2 |
GPU frequency |
750 MHz |
Shading units |
128 |
Total shaders |
256 |
Vulkan |
1.1 |
OpenCL |
2 |
DirectX version |
12.1 |
AI processor (machine learning) |
Hexagon 685 |
Max display resolution |
2560 x 1600 |
Max camera resolution |
1x 192MP, 2x 16MP |
Video capture |
4K at 30FPS |
Video playback |
4K at 30FPS |
Video codecs |
H.264, H.265, VP8, VP9 |
Audio codecs |
AAC, AIFF, CAF, MP3, MP4, WAV |
Max Memory |
8GB |
RAM Type |
LPDDR4X |
Maximum bandwidth |
14.9 Gbps |
Bus |
2x 16 Bit |
Storage |
eMMC 5.1, UFS 2.1 |
Technology Process |
10 nm |
Wattage (peak TDP) |
9W |
Features |
Snapdragon X12 modem up to 150 Mbps |
4G Modes |
LTE Cat. 12 |
5G support |
No |
Wi-Fi version |
5 |
Bluetooth version |
5 |
Navigation |
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS |